Tactile switch SMT3/SMTE3
- ●Um einen Kauf zu tätigen, wenden Sie sich an die Verteiler
oder nutzen Sie den stehenden Online-Shops unten.
Verkaufskanal Überprüfen Sie die Verteiler.- VERKAUFSKANALKlicken Sie hier, um den Verteiler zu überprüfen.
Surface Mount Tactile Switches
- Compatible With Lead-Free, Reflow Soldering
Heat-resistance resin for lead-free soldering. - Washable (SMTE3 Series)
- J-Lead Terminal Pins For High-Density Mounting
- Anti-Static Electricity (SMTE3 Series)
Ground terminal is provided to prevent damage to element caused by static electricity.
◆Structure
Specifications
| Rating Max. | 0.6 VA max. (24 VDC max. 30 mA max.） |
|---|---|
| Rating Min. | Silver plated contacts 1 mA 5 VDC（Resistive load） Gold plated contacts 10 μA 5 VDC（Resistive load） |
| Initial contact resistance | 100 mΩ max. (1.5 mA 200 μVAC) |
| Dielectric strength | 250 VAC 1 minute |
| Insulation resistance | 100 MΩ min. (100 VDC) |
| Electrostatic capacity | 5 pF max. |
| Electrical life | 100,000 operations |
| Stroke | SMT3: 0.25 mm SMTE3: 0.5 mm |
| Operating force | SMT3: 1.18 ± 0.39 N SMTE3: 1.96 ± 0.98 N |
| Operating temperature range | - 25 ~ ＋ 70 ℃ |
| Storage temperature range | - 40 ~ ＋ 85 ℃ |
Part number designation
| SMT | E | G | 3 - | 01 | E- | Z |
|---|---|---|---|---|---|---|
|
Series code None: Standard type (Plastic button) Immersion washable (Rubber button) |
Structure |
Contact plating None: Silver plated |
Series No. |
Registration No. |
Packaging specs. None: Stick |
List of part numbers
| Part Number | Structure | Packaging | CAD |
|---|---|---|---|
| SMT3-01-Z | Standard type (Plastic button) | Stick | |
| SMTE3-01-Z | Immersion washable (Rubber button) | Stick | |
| ★SMTEG3-01-Z | Immersion washable (Rubber button) | Stick | |
| SMT3-01E-Z | Standard type (Plastic button) | Emboss taping | |
| ★SMTG3-01E-Z | Standard type (Plastic button) | Emboss taping | |
| SMTE3-01E-Z | Immersion washable (Rubber button) | Emboss taping | |
| ★SMTEG3-01E-Z | Immersion washable (Rubber button) | Emboss taping |
Outline Dimensions
(Unit:mm)
Pad Layouts
Soldering Specifications
- Manual Soldering
Device : Soldering iron
①350 °C ± 10 °C; 3 ± 0.5 seconds - Reflow Soldering
Device : Inline or batch system
・Apply reflow soldering up to 2 times max.
Flux Cleaning
※Since the SMT3 series is not process sealed, be sure to use low-residue flux.
- Solvent: Fluorine or Alcohol type Cleaning with other solvents or water is not possible.
- Cleaning after soldering should be done after the terminal temperature falls to 90 °C or below, or after leaving the switch for five minutes or longer at room temperature. Cleaning temperature: 43°C, max.
- Do not use ultrasonic cleaning.
Packaging Specifications
(Unit:mm)
| Stick specification | Emboss taping specification |
|---|---|
|
|
|
Minimum packaging quantity for reel packaging is 1,000 pcs per reel.
Unterlagen
Umweltdaten
- ●Die oben genannten Inhalte können ohne vorherige Ankündigung geändert werden.
Produkte
